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NeuDist (version 1.0.1)

conductors: Electromigration Failure Times of Microcircuit Conductors

Description

Failure-time data from an accelerated life test involving 59 microcircuit conductors. Electromigration refers to the movement of atoms in conductors under high current density, leading to eventual failure. The dataset contains observed failure times (in hours), with no censored observations.

Usage

data(conductors)

Arguments

Value

An object of class "numeric".

The vector consists of 59 observed failure times (in hours), each corresponding to a single microcircuit conductor subjected to an accelerated life test. Each value represents the elapsed operating time until failure caused by electromigration. The dataset is commonly used in reliability engineering and lifetime data analysis to illustrate wear-out mechanisms and to fit and compare parametric lifetime models such as the Weibull, lognormal, and power-lognormal distributions.

Format

A numeric vector of length 59 giving failure times in hours.

Details

Electromigration is a major wear-out mechanism in thin-film microelectronic circuits. Because electric current accelerates atomic migration, accelerated life tests are widely used to study the reliability of conductors. This dataset has been used extensively in the reliability literature, including analyses involving Weibull, lognormal, and power-lognormal lifetime models.

References

Lawless, J. F. (2003). Statistical Models and Methods for Lifetime Data. John Wiley & Sons.

Nelson, W., & Doganaksoy, N. (1995). Statistical analysis of life or strength data from specimens of various sizes using the power-(log)normal model. Recent Advances in Life-Testing and Reliability, 377--408.

Examples

Run this code
data(conductors)

# Summary statistics
summary(conductors)

# Histogram of failure times
hist(conductors)

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