An experiment on integrated circuits was reported by Phadke et al. (1983). The width of lines made by a photoresist-nanoline tool were measured in five different locations on silicon wafers, measurements being taken before and after an etching process being treated separately. Here, the pre-etching data are analyzed. The eight experimental factors (A-H) were arranged in an L18 orthogonal array and produced 33 measurements at each of five locations, giving a total of 165 observations. There were no whole-plot (i.e. between-wafer) factors.
data("circuit")A data frame with 165 observations on the following 13 variables.
Widthwidth of lines made by a photoresist-nanoline tool
Aa factor A with levels 1, 2 and 3
Ba factor B with levels 1, 2 and 3
Ca factor C with levels 1, 2 and 3
Da factor D with levels 1, 2 and 3
Ea factor E with levels 1, 2 and 3
Fa factor F with levels 1, 2 and 3
Ga factor G with levels 1, 2 and 3
Ha factor H with levels 1, 2 and 3
Ia factor I with levels 1, 2 and 3
Waferwafers indenfifier
wafreplication number for two replicates
expexperiment number for differenct array
Phadke, M.S., Kacka, R.N., Speeney, D.V. and Grieco, M.J. (1983). Off-line quality control for integrated circuit fabrication using experimental design. Bell System Technical Journal, 62, 1273--1309.