wafers: Data from a resistivity experiment for semiconductor materials.
Description
This data set was reported and analyzed by Robinson et al. (2006) and reanalyzed by Lee et al. (2011). The data
deal with wafers in a single etching process in semiconductor manufacturing.
Wafers vary through time since there are some variables that are not perfectly controllable in the etching process. For this
reason, wafers produced on any given day (batch) may be different from those produced on another day (batch). To measure
variation over batch, wafers are tested by choosing several days at random. In this data, resistivity is the response of interest.
There are three variables, gas flow rate (x1), temperature (x2), and pressure (x3) and one random effect (batch or day). (Lee et al 2011).
Usage
data(wafers)
Arguments
source
This data set was manually pasted from Table 3 of Lee et al. (2011). Transcription errors may have occurred.
References
Robinson TJ, Wulff SS, Montgomery DC, Khuri AI. 2006. Robust parameter design using generalized linear mixed models. Journal of Quality
Technology 38: 38--65.
Lee, Y., Nelder, J.A., and Park, H. 2011. HGLMs for quality improvement.
Applied Stochastic Models in Business and Industry 27, 315-328.