solder

0th

Percentile

Data from a soldering experiment

In 1988 an experiment was designed and implemented at one of AT&T's factories to investigate alternatives in the "wave soldering" procedure for mounting electronic componentes to printed circuit boards. The experiment varied a number of factors relevant to the process. The response, measured by eye, is the number of visible solder skips.

Keywords
datasets
Usage
data("solder")
Details

This data set is used as a detailed example in chapter 1 of Chambers and Hastie. Observations 1-360 and 541-900 form a balanced design of 3*2*10*3= 180 observations for four of the pad types (A1.5, A3, B3, B6), while rows 361-540 match 3 of the 6 Solder*Opening combinations with pad type A6 and the other 3 with pad type A3.

Format

A data frame with 900 observations on the following 6 variables.

Opening

the amount of clearance around the mounting pad (3 levels)

Solder

the amount of solder (Thick or Thin)

Mask

type and thickness of the material used for the solder mask (A1.5, A3, A6, B3, B6)

PadType

the geometry and size of the mounting pad (10 levels)

Panel

each board was divided into 3 panels

skips

the number of skips

References

J Chambers and T Hastie, Statistical models in S. Chapman and Hall, 1993.

Aliases
  • solder
Examples
# NOT RUN {
data(solder)
# The balanced subset used by Chambers and Hastie
#   contains the first 180 of each mask and deletes mask A6. 
index <- 1 + (1:nrow(solder)) - match(solder$Mask, solder$Mask)
solder.balance <- droplevels(subset(solder, Mask != "A6" & index <= 180))
# }
Documentation reproduced from package survival, version 3.1-8, License: LGPL (>= 2)

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